Date published 
  1. Prakticka Elektronika 2000-08
  3. 74LS06.pdf

74LS SN74LS06NSRG4. ACTIVE. SO. NS. Green (RoHS. & no Sb/Br). CU NIPDAU. LevelC-UNLIM. 0 to 74LS SNJ54LS06FK. 74LS06 datasheet, 74LS06 pdf, 74LS06 data sheet, datasheet, data sheet, pdf, Hitachi Semiconductor, HEX INVERTER BUFFERS/DRIVERS WITH. 74LSpdf - Download as PDF File .pdf), Text File .txt) or read online.

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74ls06 Pdf Download

IC Datasheet: 74LS comment. Reviews. There are no reviews yet. Be the first one to write a review. Views. DOWNLOAD OPTIONS. description/ordering information. These hex inverter buffers/drivers feature high- voltage open-collector outputs to interface with high-level circuits (such as MOS), . Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for.

It should be directly importable into their order system. ParPortProp - Mouser. This firmware controls the operation of the on-board Propeller processor which automatically loads the firmware at startup. Once the Propeller has loaded the firmware, it will initialize all peripherals and begin waiting for commands from the host Zeta. Since the ParPortProp is purely a slave processor for a host Zeta, it is also necessary that the host Zeta be programmed with an appropriate ROM image that includes support for an attached ParPortProp. At this time, RomWBW v2. Download this file onto your local machine and unzip it with any standard decompression tool. Once this is done, you can follow the instructions below to complete the programming of the Zeta and the ParPortProp.

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Jos falis vigor download itunes. Use only an anti-static type solder removal device. Do not use freon-propelled chemicals. These can insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES using an insulating handle to avoid personal contact devices.

Do not remove a replacement ES device from its 4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are of its assemblies.

Prakticka Elektronika 2000-08

Most replacement ES devices are 5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable mixture to the contacts with a pipe cleaner, cotton- conductive material. Minimize bodily motions when handling unpackaged with which receivers covered by this service manual replacement ES devices.

Otherwise harmless motion might be equipped. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last. Use a grounded-tip, low-wattage soldering iron and 1.


Carefully insert the replacement IC in the circuit board. Carefully bend each IC lead against the circuit foil pad temperature within the range or F to F.

Use an appropriate gauge of RMA resin-core solder 3. It is not necessary to reapply acrylic coating to 3. Keep the soldering iron tip clean and well tinned.

Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle 0. Remove the defective transistor by clipping its leads as 5. Use the following unsoldering technique close as possible to the component body.

Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads temperature. Bend into a "U" shape the replacement transistor leads.

Heat the component lead until the solder melts. Connect the replacement transistor leads to the c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal braid.

Power Output, Transistor Device 6. Use the following soldering technique. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor temperature F to F leads.


First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw if so equipped. Carefully remove the transistor from the heat sink of the circuit board. Quickly move the soldering iron tip to the junction of 4.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples. The outputs are measured one at a time with one input transition per measurement.


Figure 1. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty.

Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design.

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